時間：2015年4月2日（星期四）9:00-12:00

地點：NCAP F6培訓室

主講人：Reinhold H. Dauskardt

講座性質： R公開   □非公開

主辦單位：華進半導體封裝先導技術研發中心有限公司

　　　　　沈陽拓荊科技有限公司

 【講座概要】

Materials and interfaces in emerging devicetechnologies operate near the envelope of their mechanical and adhesiveproperties with remarkably high levels of film stress. Debonding and cohesivefracture are major challenges for device reliability at all levels ofprocessing, packaging and service. The thermomechanical properties of devicestructures including complex back-end interconnect and emerging 3-D structuresare critical for aiding new materials integration as well as understandingdevice reliability.

We describe research aimed at characterizingthin-film thermomechanical properties including adhesion and cohesion that arecritical for emerging device technologies. Particular challenges of integratingnanostructured materials like nanoporous ULK materials and ultra-thin barriersare considered. Using a combined molecular modeling and materials synthesisstrategy we show how manipulating the composition and molecular structure ofULK materials can be used to optimize thermomechanical properties.

Packaging advanced silicon devices has becomeincreasingly challenging because the effects of stresses exerted oninterconnect and through-via structures during processing and package assemblyare not well characterized or understood. Accordingly, we describe a microprobemetrology which can precisely impose both normal and shearing stresses tolocalized regions of these structures. The intent is to quantitatively measure local stiffness, strength,deformation, and damage processes and relate them to stresses that may beexperienced during device packaging or assembly of 3D structures. 

We finally consider how fabrication or operatingenvironments may affect device reliability. We will particularly consider the synergistic effects of environmentalspecies like water and surfactant molecules, mechanical stresses, temperatureon the kinetic processes of damage formation and growth.  These are central to understanding andpredicting device reliability through processing and service.

【主講人簡介】

Reinhold H. Dauskardt博士是材料科學與工程系的Ruth G. 和 William K. Bowes教授，同時受聘于機械工程，生物設計學院和醫學院外科系。他的研究團隊致力于將新材料融入到新興設備和能源科技，生物機械以及人類皮膚和軟組織的再生過程。他是熱機械可靠性方面國際公認的專家，倡導薄膜結構中黏附力和內聚力特性的量化方法。實驗研究中進行了計算和模型模擬。他得過許多獎項，其中包括Maso獎以表彰對皮膚科學的基本貢獻(2011)，IBM大學研究獎為表彰他的科學技術研究成果(2011)，半導體工業協會大學研究獎以表彰他的研究對半導體工業科學和技術實質性和持續性的貢獻(2010)，IBM學院獎(2006)，ASM國際銀質獎章(2003)，亞歷山大?馮?洪堡研究獎(2002)，美國能源部杰出科學成就獎(1989)。他是美國陶瓷協會(2008)和ASM國際組織(2010)的會員。他的跨學科研究包括與學術，工業和臨床的研究人員相互合作。他已經在科學文獻中出版300多篇文章。