華進半導體主辦的“華進開放日”活動已成功舉辦了四屆，曾邀請到了無錫市政府、中國工程院院士、中科院外籍院士、02專項總師、江蘇省產業技術研究院、無錫科技局、國家封測聯盟、新區科技局等領導到會演講與發言，在行業內得到了一致的歡迎與肯定。

2016年是國家“十三五”規劃實施的第一年，集成電路產業作為規劃中的戰略性新型產業將迎來發展的關鍵期，創新、開放、綠色、融合將是IC產業的發展方向，而集成電路封裝測試是產業鏈的重要環節，也將迎來重大發展機遇。《國家集成電路產業發展推進綱要》中，明確提出“提升先進封裝測試業發展水平。大力推動國內封裝測試企業兼并重組，提高產業集中度。適應集成電路設計與制造工藝節點的演進升級需求，開展芯片級封裝（CSP）、圓片級封裝（WLP）、硅通孔（TSV）、三維封裝等先進封裝和測試技術的開發及產業化”。在此背景下，現定于2016年11月10日--11日召開第五屆“華進開放日”暨先進半導體封裝技術研討會。

會議將邀請政府領導及國內外知名學者到會演講，從產業政策、系統需求、封裝工藝、設備與材料等向與會人員展示新一代封裝的技術前景。

會議時間：2016年11月10日--11月11日

會議地點：無錫新湖鉑爾曼大酒店3樓翡翠廳（新吳區和風路30號）

指導單位：新吳區人民政府、江蘇省產業技術研究院、無錫市科技局、國家IC封測產業鏈技術創新戰略聯盟

承辦單位：華進半導體封裝先導技術研發中心有限公司（半導體封裝技術研究所）、江蘇省半導體行業協會

支持單位：SEMI、中國半導體行業協會集成電路分會、江蘇省IC產業鏈技術創新戰略聯盟、無錫市半導體行業協會

會議議程：

2016年11月10日（星期四）8:45-18:00

2016年11月11日（星期五）8:45-17:00

華進聯系人：

劉海燕   0510-6667 1516、1893607 1918、haiyanliu@ncap-cn.com

許  超   0510-6667 0816、136 6510 0100、

chaoxu@ncap-cn.com

聯盟聯系人：

張瓊月   159 50418867

陳浩鵬   134 86177790

聯盟郵箱 cjssia@yeah.net

住宿（需自理）：

無錫新湖鉑爾曼大酒店（新吳區和風路30號）

（會議協議價400元/天，含早餐2份，自行預定時需報華進公司名字）

酒店聯系人：史經理   1805195 1868

參會報名：

聯盟、聯合體、協會會員免費參加；非聯盟、聯合體和協會會員，報名費500元/位。

參會回執：

見附件“參會回執表”。

演講嘉賓介紹

張原

EducationBackground:

1996.9~1999.4   Graduate Institute of BUAA (Beijing Universityof Aeronautics and Austronautics), and got Master degree of Material Science

1992.9~1996.7 Material Department of BUAA, and got bachelor’s degree of Metal

Work Introduction:

ZhangYuan joined HUAWEI technologies Co.LTD in 1999 and focused on developingelectronic engineering for 17 years.

2011-now，I work in Board Engineering TechnologyStrategy and Plan department for sourcing new copartner and supporting the newproject development，especially for passive opticalinterconnection.

2010-2011,I also responsible for SIP package process

2008-2011, I became optical electrical process technical manager and give technologyassurance for optical electrical modules and subassembly.

2005~2007,I have been assembly material technical manager and give technology assurancefor electrical material suppliers.

During2000 to 2006,I served as the first PCB technical manager ,devoting my effort tosourcing PCB suppliers and developing new technologies with them together.

JamesE. Morris

Jim is a ProfessorEmeritus of Electrical & Computer Engineering at Portland State University,Oregon, and at the State University of New York at Binghamton.  His B.Sc.and 1st Class Honors M.Sc. degrees in Physics are from the University of Auckland,New Zealand, and his Ph.D. in Electrical Engineering is from the University ofSaskatchewan, Canada.  He has served as Department Chair at bothBinghamton and Portland, and was the founding Director of Binghamton’s Institute for Research in Electronics Packaging. Jimhas also held faculty positions at Saskatchewan, Victoria University ofWellington (NZ), and South Dakota School of Mines & Technology, withvisiting/sabbatical positions at Loughborough University (UK) as a RoyalAcademy of Engineering Distinguished Visiting Fellow, Chemnitz University ofTechnology (Germany), University of Maryland (USA), University of Bordeaux(France), University of Greenwich (London), Chalmers University of Technology(Sweden), Dresden University of Technology, University of Canterbury (NZ) as anErskine Fellow, and Helsinki University of Technology as a Nokia-FulbrightFellow, with honorary appointments at Shanghai University and Shanghai JiaoTong University. Other positions have included Senior Technician and Post-DoctoralFellow at the U of S, brief periods with Delphi Engineering (NZ) andIBM-Endicott (New York), and industrial consulting. He was recognized in 2015with an honorary doctorate from the POLITEHNICA University of Bucharest.

Jim is an IEEE LifeFellow and a Distinguished Lecturer for both the IEEE Nanotechnology Council(NTC) and the IEEE Components, Packaging, & Manufacturing (CPMT) Society.He has served as CPMT Treasurer (1991-1997) and Vice-President for Conferences(1998-2003), and currently sits on the CPMT Board of Governors (1996-1998,2011-2016) and on the joint Oregon CAS/CPMT Chapter executive committee, andchairs the CPMT Nanotechnology technical committee. He was awarded the IEEEMillennium Medal and won the CPMT David Feldman Outstanding Contribution Awardin 2005. He is an Associate-Editor of the IEEE CPMT Transactions and has beenGeneral Chair of three CPMT-sponsored conferences, Treasurer or Technical Chairof others, and serves on several CPMT conference committees. As the CPMTSociety representative on the NTC, he instituted a regular Nanopackaging seriesof articles in the IEEE Nanotechnology Magazine, established the NTCNanopackaging technical committee, (which also acts as a program committee forannual IEEE NANO conferences,) served as the 2010-2012 NTC Awards Chair,chaired the IEEE NANO 2011 conference in Portland, and served as NTCVice-President for Conferences (2013-2014) and currently as Vice-President forFinance (2015-2018.) He also co-founded the Oregon Chapter of the IEEE EducationSociety in 2005 and sits on its executive committee, and was Program Chair forthe 1^st and 2^nd IEEE Conferences on Technology forSustainability (2013/14).  

His researchactivities are focused on electrically conductive adhesives, the electrical conductionmechanisms in discontinuous nanoparticle thin metal films, with applications tonanopackaging and single-electron transistor nanoelectronics, and on anNSF-funded project in undergraduate nanotechnology education. He has edited orco-authored five books on electronics packaging and two on nanodevices, andlectures internationally on nanopackaging and electrically conductiveadhesives. He is currently putting together the expanded second edition of hisbook: “Nanopackaging:Nanotechnologies and Electronics packaging” (Springer,2017.).

RichardRAO

Dr. RichardRAO is currently a Technical Fellow of Microsemi Corp, a lead supplier ofhigh reliability integrate circuit, located in southern California, USA and anelected Senior Member of IEEE.  He managesthe corporate reliability program and his main focus is to develop design forreliability flows for advanced circuits, packaging and chip to packageinteraction. He has a Ph.D. degree in solid mechanics of materials from theUniversity of Science and Technology of China. Prior to joining Microsemi in2004, Dr. Raoheld various academic and technical positions in reliabilityphysics and engineering. He was an associate professor at University of Scienceand Technology of China, a research fellow at Northwestern University,Evanston, IL, USA and National Science and Technology Board of Singapore. Healso held senior and principal engineering positions in Motorola Electronicsand Ericsson Inc. He has published over 30 papers on reliability physics andapplications and also a main contributor of several JEDEC standards. He servesas the technical committee member for ECTC (Electronics Component andTechnology Conference) and IRPS (International Reliability and PhysicsSymposium). He is a speaker to IRPS, ECTC, ISQED (International Symposium onQuality Electronics Design), ASME Symposiums and a keynote speaker to ICEPT andInternational Conference on System on Chip, etc.

Dr. Rao has over 20years’ hands on experienceand knowledge in the advanced packaging technologies such as big size FCBGA,TSV based 2.5D and non-TSV based 2.5D packages; advanced wafer processes suchas 28nm HKMG and 16nm FF, advanced IC and optical packaging, chip to packageinteraction, board and system level reliability physics and applications. Hehas conducted professional development courses on advanced IC reliability toboth industrial and academic worlds.

AndrewTay

博士，新加坡國立大學機械工程系教授。獲澳大利亞新南威爾士州大學教育學碩士學位(一級榮譽大學獎章)和機械工程博士學位。主要研究領域包括：IC封裝的熱機械失效、熱管理、圓片級封裝,焊點可靠性和MEMS(微機電系統)。曾擔任過ASME（美國機械工程師協會）《電子封裝》雜志的副主編，《微電子學》雜志和《有限元分析和設計》雜志編輯部成員。1997年-1998年，擔任新加坡IEEE第一二屆電子封裝技術會議大會執行主席。世界40多家知名公司和組織聘請ANDREW TAY博士為顧問，如新加坡港務局港，遠東Levingston造船有限公司，加德士（亞洲）有限公司，索尼精密工程中心，惠普（新加坡），德州儀器（新加坡），德爾福汽車系統新加坡私人有限公司等。他一直服務于幾個國際封裝會議的國際顧問委員會和組織委員會，如ECTC, Inter Pack, EPTC, ITHERM等。因為其突出的成就和貢獻，在2000年被授予IEEE第三千禧年獎章。由于其在機械工程、電子/光電子封裝應用領域的突出貢獻獲得了2004年ASME EPPD機械工程獎，2012年，因ANDREW TAY博士的卓越的領導才能和特別貢獻，獲得CPMT10（亞太）地區貢獻獎。同時他也是ASME成員和新加坡工程師學會的院士。申請3項美國專利，主持或參與完成專著3部在國際核心期刊上發表期刊論文52余篇，會議論文152余篇。

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