1.Electronic Packaging Technology and Materials

● Abstract：Polymers andnanocomposites are widely used in electronic and photonic packaging asadhesives, encapsulants, insulators, dielectrics, molding compounds andconducting elements for interconnects. These materials also play a criticalrole in the recent advances of low-cost, high performance novel No FlowUnderfills, Reworkable Underfills for Ball Grid Array (BGA), Chip ScalePackaging (CSP), System in a Package (SIP), Direct Chip Attach (DCA), Flip-Chip(FC), Paper-thin IC and 3D Packaging, Conductive Adhesives (both ICA and ACA),Embedded Passives (high K polymer composites), nano particles andnanofunctional materials such as CNTs, graphenes. It is imperative that bothmaterial suppliers, formulators and their users have a thorough understandingof polymeric materials and the recent advances on nano materials and theirimportance in the advances of the electronic packaging and interconnecttechnologies.

● About the speaker：Prof. Wongis a Regents’ Professor and the Charles Smithgall Institute Endowed Chair atthe School of Materials Science and Engineering, Georgia Institute ofTechnology (GT) and is the Dean of the Faculty of Engineering School, CityUniversity of Hong Kong (CUHK). He is also the team leader of the Guangdong Innovation Team for the Advanced Electronic PackagingMaterials (SIAT). Professor Wong has published widely with over 1000 technicalpapers and yielded fruitful research results and holds over 50 US patents.Professor Wong is considered an industry legend and has made significantcontributions to the industry by pioneering new materials, which fundamentallychanged the semiconductor packaging technology.

Professor Wong was awarded numerousinternational honors, such as being elected as AT&T Bell LaboratoriesFellow in 1992, the IEEE CPMT Society Outstanding Sustained TechnicalContributions Award in 1995, member of the US National Academy of Engineeringin 2000, the IEEE Third Millennium Medal in 2000, the IEEE EAB Education Awardin 2001, the IEEE CPMT Society Exceptional Technical Contributions Award in2002, the Georgia Tech Class 1934 Distinguished Professor Award in 2004, namedholder of the Charles Smithgall Chair (one of the two GT Institute Chairs) in2005, the GT Outstanding PhD Thesis Advisor Award, the IEEE Components,Packaging and Manufacturing Technology Field Award in 2006, the Sigma Xi’sMonie Ferst Award in 2007, the Society of Manufacturing Engineers’ TotalExcellence in Electronic Manufacturing Award in 2008 and the IEEE CPMT DavidFeldman Award in 2009 and Dresden Barkhausen Award in 2012. He has recentlyreceived the Pennsylvania State University Outstanding Science Alumni Award.

2. HPC and AdvancedPackaging Technology Development

●  Abstract: In recent development of semiconductor technologies, it isbecoming more and more clear that the AI, typically presented by the cloudcomputations, autonomous vehicles and neural networks, will be the next majorarea of applications.  One of the keycharacteristics of the AI applications is that it demands for high speed andextensive computation power.  However,since the Moore’s Law is approachingits limit and the IC performance improvement by scaling will slow downeventually, using packaging technology to enhance the IC performance becomesurgent and important. In this presentation, the evolution of packagingtechnologies in high speed applications is introduces. Several advancedpackaging platforms and their design and process challenges are presented. Newand potential packaging solutions and development progress are discussed.

● About thespeaker: Yifan Guo is a Vice President ofEngineering in ASE Group.  In past 30years, he has taken positions as Professors and Adjunct Professors at VirginiaTech, State University of New York at Binghamton and University of Californiaat Irvine. He has also worked for IBM, Motorola, Skyworks, ASE, and heldpositions from middle to high level management in charges of R/D, engineeringand operation. He has published 7 book chapters, 9 patents and more than 50refereed journal papers. Yifan Guo got his Ph.D degree from Engineering Scienceand Mechanics (ESM) Department at Virginia Tech. and MBA degree from School ofBusiness at University of Redlands in California.

3. Accurate PackageCharacterization and Modeling for RFIC Design

● Abstract: Packages have great impacts on RFIC and high-speed IC performancefor both bond-wire and package lead. They should be accurately characterizedand modeled preferably in an equivalent circuit (EQC) model, so that they canbe co-simulated for a reliable RFIC design. Although EM simulation is nowwidely used, it should be verified by practical measurement. This lecture willtalk about experimental technique for accurate package modeling including fullL and C matrix, as well as ground inductance based on VNA technique using RFprobe station. Advanced EQC models are developed for RFIC design which havebeen proven for first-pass succss in packaged IC testing.

● About thespeaker: Fujiang Lin received the BSEE and MSEEdegrees from USTC, Hefei, China, and the Dr.-Ing. degree in MMIC from theUniversity of Kassel, Germany. Dr. Lin has been the “Chinese K-Talent Program”full time professor at USTC since 2010. He established the USTCMicro/nano-Elecronic System Integration R&D Center (MESIC) focusing onadvanced nanotech devices modeling and IC design. Prior returning back USTC,Dr. Lin worked as SMTS and PI in the Institute of Microelectronics, A*STAR,Singapore; as adjunct Associate Professor at NUS; as Director in CHRT (nowGlobalFoundries), as Technical Director at HP/Agilent (now Keysight) EEsof; asfounder and CEO of Transilica Singapore. Professor Lin has extensive hand-onand multi-discipline experiences and knowledge in advancedmicro-/nano-electronics technologies, RF modeling for MMIC/RFIC and Packages,as well as the related integrated circuits and system design.