半導(dǎo)體產(chǎn)業(yè)2017年表現(xiàn)不俗，有數(shù)字為證：增長(zhǎng)率超過21.6%，達(dá)到4120億美元左右。毫無疑問，該產(chǎn)業(yè)正在邁入一個(gè)嶄新的時(shí)代，創(chuàng)新和顛覆是這個(gè)時(shí)代的關(guān)鍵詞。除了移動(dòng)設(shè)備，Yole的分析師們指出大數(shù)據(jù)、AI、5G、HPC、IoT、智能汽車、工業(yè)4.0、數(shù)據(jù)中心等正成為改變我們這個(gè)世界的新興強(qiáng)大驅(qū)動(dòng)力。所有這些正在變成我們的生活日常并對(duì)半導(dǎo)體產(chǎn)業(yè)及其供應(yīng)鏈產(chǎn)生直接影響。不僅如此，Yole在其最新報(bào)告《先進(jìn)封裝產(chǎn)業(yè)態(tài)勢(shì)》中預(yù)測(cè)，先進(jìn)封裝市場(chǎng)將以7%的年均復(fù)合增長(zhǎng)率在2023年達(dá)到390億美元的驚人規(guī)模......

　　“大趨勢(shì)帶來的顯著影響帶動(dòng)市場(chǎng)風(fēng)向發(fā)生轉(zhuǎn)變，也由此推動(dòng)先進(jìn)封裝的發(fā)展，”Yole半導(dǎo)體與軟件部主管Emilie Jolivet解釋道：“Yole和華進(jìn)半導(dǎo)體（NCAP）已決定要在今年再度聯(lián)手，結(jié)合各自的專業(yè)優(yōu)勢(shì)，在上海舉辦先進(jìn)封裝與系統(tǒng)集成技術(shù)研討會(huì)，緊隨其后的就是中國(guó)國(guó)際電子生產(chǎn)設(shè)備暨微電子工業(yè)展（NEPCON）。這次在上海舉辦的會(huì)議能讓各方了解產(chǎn)業(yè)發(fā)展并估量大趨勢(shì)帶來的影響。”

　　華進(jìn)半導(dǎo)體與Yole為先進(jìn)封裝產(chǎn)業(yè)量身定制了一系列創(chuàng)新活動(dòng)日程：先進(jìn)封裝與系統(tǒng)集成技術(shù)研討會(huì)將在2019年4月22日至23日在中國(guó)上海舉行。為期2天的會(huì)議討論將涵蓋封裝產(chǎn)業(yè)的方方面面，包括面板級(jí)、扇出型、系統(tǒng)級(jí)封裝、先進(jìn)基板和3D技術(shù)。會(huì)議將重點(diǎn)聚焦關(guān)鍵應(yīng)用領(lǐng)域，如AI、HPC、存儲(chǔ)器、運(yùn)輸（48V、EV/HEV、嵌入式晶片封裝平臺(tái)、PCB、先進(jìn)基板……）、5G和消費(fèi)類等等都將是會(huì)議的中心議題。兩家聯(lián)合主辦方誠(chéng)邀您與業(yè)界領(lǐng)袖的高管會(huì)面，深入了解市場(chǎng)的演化發(fā)展！ 

　　大趨勢(shì)在各種先進(jìn)封裝平臺(tái)之間創(chuàng)造了巨大的商機(jī)，因此先進(jìn)封裝技術(shù)在滿足更高性能和復(fù)雜的異構(gòu)集成需求方面正是理想之選。

　　 “我們預(yù)測(cè)未來將從尺寸和功能衍生出兩類先進(jìn)封裝發(fā)展路線，”Yole韓國(guó)分公司封裝、組裝與基板業(yè)務(wù)主管兼首席分析師Santosh Kumar稱：“而且半導(dǎo)體產(chǎn)業(yè)正在為這兩者都開發(fā)產(chǎn)品。先進(jìn)封裝可以為半導(dǎo)體產(chǎn)品提升價(jià)值，在降低產(chǎn)品成本的同時(shí)增加其功能性，并維持或提高其性能……”

　　根據(jù)Yole半導(dǎo)體與軟件團(tuán)隊(duì)所開發(fā)的這兩類發(fā)展路線，未來將出現(xiàn)更多的多芯片異構(gòu)集成，也就是所謂的系統(tǒng)級(jí)封裝，還將有更高層面的封裝定制。無論是高端還是低端產(chǎn)業(yè)，無論是針對(duì)消費(fèi)型、性能型還是專用型應(yīng)用領(lǐng)域，各式各樣的系統(tǒng)級(jí)封裝都在開發(fā)中。異構(gòu)集成無疑已經(jīng)為基于基板和WLP的系統(tǒng)級(jí)封裝都創(chuàng)造了機(jī)會(huì)……
不僅如此，先進(jìn)封裝供應(yīng)鏈也在這個(gè)傳奇故事中占有一席之地。業(yè)界領(lǐng)袖、初創(chuàng)公司、研發(fā)機(jī)構(gòu)，全球先進(jìn)封裝產(chǎn)業(yè)都參與其中。為了拓展業(yè)務(wù)、探索新的領(lǐng)域并準(zhǔn)備好迎接未來的不確定性，先進(jìn)封裝領(lǐng)域的企業(yè)都在向不同的經(jīng)營(yíng)模式轉(zhuǎn)變：

? 部分像英特爾這樣的IDM正在進(jìn)入代工市場(chǎng)，以發(fā)揮其在前端技術(shù)上的專長(zhǎng)，并通過利用自身的富余產(chǎn)能增創(chuàng)收益。三星、SK海力士半導(dǎo)體也都在此列......
? OEM廠商、軟件與服務(wù)公司正在設(shè)計(jì)自有芯片并控制著與之相關(guān)的設(shè)備與材料供應(yīng)鏈。部分OSAT想在AI這樣的大趨勢(shì)上碰碰運(yùn)氣，正在向輕晶圓廠的商業(yè)模式拓展。
? 包括臺(tái)積電（TSMC）、武漢新芯（XMC）、聯(lián)華電子（UMC）和中芯國(guó)際（SMIC）在內(nèi)的單純代工廠正在涉足高端封裝業(yè)務(wù)，為其客戶提供一站式解決方案。
? 像Amkor Technology、江蘇長(zhǎng)電（JCET）/STATS ChipPAC、日月光（ASE）、矽品（SPIL）、力成科技（Powertech Technology）等這樣的OSAT正以相當(dāng)可觀的投入開發(fā)先進(jìn)晶圓級(jí)和3D IC封裝產(chǎn)能，以支持尺寸和密度方面的需求。OSAT公司正在擴(kuò)展其測(cè)試專長(zhǎng)，而傳統(tǒng)的測(cè)試公司則在組裝與封裝產(chǎn)能上進(jìn)行投入。 
? 基板制造廠商正以面板級(jí)扇出型封裝和有機(jī)薄膜中的嵌入式晶片打入先進(jìn)封裝領(lǐng)域。

　　正如標(biāo)題所述，先進(jìn)封裝就是創(chuàng)新之心。大趨勢(shì)應(yīng)用正帶來新的挑戰(zhàn)，全球領(lǐng)先的先進(jìn)封裝公司將齊聚先進(jìn)封裝與系統(tǒng)集成技術(shù)研討會(huì)，交流彼此的愿景和對(duì)未來的看法。
華進(jìn)半導(dǎo)體總經(jīng)理曹立強(qiáng)博士稱：“在中國(guó)十三五計(jì)劃和中國(guó)制造2025兩項(xiàng)計(jì)劃的背景下，包括華進(jìn)半導(dǎo)體在內(nèi)的國(guó)內(nèi)企業(yè)關(guān)注半導(dǎo)體產(chǎn)業(yè)的核心技術(shù)開發(fā)，并取得了重大進(jìn)展。促進(jìn)先進(jìn)封裝方面的國(guó)際溝通和全球合作是Yole和華進(jìn)半導(dǎo)體的共同目標(biāo)，也是我們堅(jiān)持組織本次活動(dòng)并使之成為一年一度盛事的原因。憑借著良好聲譽(yù)、熱門議題和富有洞見的演講，我們堅(jiān)信2019年的研討會(huì)將大獲成功。不要錯(cuò)過這個(gè)了解技術(shù)趨勢(shì)并拓展您在華業(yè)務(wù)的好機(jī)會(huì)。”

　　2019年，Yole和華進(jìn)半導(dǎo)體策劃了一場(chǎng)獨(dú)一無二的先進(jìn)封裝與系統(tǒng)集成技術(shù)研討會(huì)，分析先進(jìn)封裝產(chǎn)業(yè)現(xiàn)狀并幫助企業(yè)成為這“明日”產(chǎn)業(yè)的一份子，活動(dòng)不容錯(cuò)過！ 
如需了解更多研討會(huì)的相關(guān)信息（活動(dòng)日程、演講者名單、社交聯(lián)絡(luò)和贊助），敬請(qǐng)聯(lián)系華進(jìn)半導(dǎo)體戰(zhàn)略部xiaoyunzhang@ncap-cn.com 或Yole市場(chǎng)與溝通總監(jiān)Camille (veyrier@yole.fr )。

原文譯自：Advanced packaging: at the heart of innovation，

原文請(qǐng)參考：http://www.yole.fr/AdvancedPackagingIndustry_NCAP_YOLE_Symposium.aspx#.XGpsbOQzbIV

ABOUT THE REPORT: 

Status of the Advanced Packaging Industry 
In the era of a slowing Moore’s Law, advanced packaging has emerged as the savior of future semiconductor development. – Produced by Yole Développement (Yole).

Companies cited in the report:

Altera, Amkor, Analog Devices, Ardentec, Atmel, AOI Electronics, Apple, ARM, ASE, Avago, Broadcom, Carsem, China WLCSP, Chipbond, ChipMOS, Cisco, Cypress Semiconductor… Full list

Author:

Santosh Kumar is Director of Packaging, Assembly, and Substrates at Yole Korea. He is involved in the market, technology, and strategic analysis of microelectronic assembly and packaging technologies. His main interest areas are advanced IC packaging technology, including equipment and materials. He has also authored several reports on fan-out/fan-in WLP, flip chip, and 3D/2.5D packaging. 
Santosh received a bachelor’s degree and master’s degree in Engineering from the Indian Institute of Technology (IIT) Roorkee and the University of Seoul, respectively. He has published more than 40 papers in peerreviewed journals and has obtained two patents. Moreover, Santosh has presented and given talks at numerous conferences and technical symposiums related to advanced microelectronics packaging.

ABOUT NCAP

The National Center for Advanced Packaging Co., Ltd. (NCAP China) is a joint venture established by ten investors, including the leaders of the IC packaging and testing industry in China. NCAP’s goal is to establish a world class R&D center for advanced packaging and system integration, play a leading role in the development and marketing of advanced technologies for microelectronics packaging and system integration, and promote and sustain the technological and commercial progress of the microelectronics industry in China.
As a national center for advanced packaging, testing and system integration, NCAP, in collaboration with system OEMs and supply chain partners, aggressively pursues research and development in order to offer complete solutions for the IC industry. NCAP’s current research areas include: 2.5D/3D technology (including TSV), high-density wafer level packaging, SiP product development capabilities, and certain advanced materials and equipment technologies for microelectronics packaging.
The NCAP R&D platform includes a 3200-m2 fully equipped cleanroom, for 300mm wafer size, for 2.5D/3D IC backend processes, and packaging assembly, testing and reliability, as well as design and simulation capabilities. More information on www.amcbg.com. 

ABOUT YOLE DEVELOPPEMENT

Founded in 1998, Yole Développement (Yole) has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services, reverse engineering and reverse costing services and well as IP and patent analysis. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole group of companies has expanded to include more than 80 collaborators worldwide covering MEMS & Sensors - Imaging - Medical Technologies - Compound Semiconductors - RF Electronics - Solid State Lighting - Displays - Photonics - Power Electronics - Batteries & Energy Management - Advanced Packaging - Semiconductor Manufacturing - Software & Computing and more...
The “More than Moore” market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting, PISEO and KnowMade, support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to grow their business. For more information, visit www.yole.fr and follow Yole on LinkedIn and Twitter.
? Consulting & Financial Services: Jean-Christophe Eloy (eloy@yole.fr)
? Reports: David Jourdan (jourdan@yole.fr)
Yole Développement, System Plus Consulting, Knowmade, PISEO and Blumorpho are part of Yole Group of Companies. Yole Group of Companies - Press Relations & Corporate Communication: Sandrine Leroy (leroy@yole.fr)