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新聞資訊

新聞資訊

News

09-27

2019

Warpage simulation and experimental veri?cation for 320mm×320mm panel level fan-out packaging based on die-?rst process, Microelectronics Reliability, 83(29-38), 2018.2.14

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09-27

2019

Design and Verification of Sub-6GHz RoF Transceiver Employing LR4 TOSA and ROSA Packaging Structure, Microwave and Optical Technology Letters, 2018

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09-27

2019

Study on Magnetic Probe Calibration in Near-field Measurement System for EMI Application, Journal of Electronic Testing, 06, 2017

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09-27

2019

Investigation of intermetallic compound and voids growth in fine-pitch Sn–3.5Ag/Ni/Cu microbumps, Journal of Materials SCIence: Materials in Electronics, 2017.

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09-27

2019

Thermo-mechanical reliability analysis of a RF SiP module based on LTCC substrate, Microelectronics Reliability, 79, 38-47, 2017

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09-27

2019

Experimental and Numerical Study of 3D Stacked Dies under Forced Air Cooling and Water Immersion, Microelectronics Reliability, 74, 34–43, 2017

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09-27

2019

Design and fabrication of a small-form transmitter optical subassembly for 100Gbps short reach optical interconnect, Microwave and Optical Technology Letters, 59(12), 3181-3185, 2017

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09-27

2019

A wet etching approach for the via-reveal of a wafer with through silicon vias, Microelectronic Engineering, 179:31-36, 2017

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09-27

2019

Design and implementation of a rigid-flex RF front-end System-in-Package, Microsystem Technologies, 23(10), 4579–4589, 2017

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09-27

2019

Design and implementation of a high-coupling and multi-channel optical transceiver with a novel packaging structure, IEEE TRANSACTIONS ON COMPONENTS,PACKAGING AND MANUFACTURING TECHNOLOGY, 7(11), 1882 – 1890,2017

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