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新聞資訊

新聞資訊

News

09-27

2019

Study on a Conformal Shielding Structure with Conductive Adhesive Coated on Molding Compound in 3D Packages, IEEE Transactions on Electromagnetic Compatibility, 58(2), 442-447, 2016

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09-27

2019

Deep dry etching of fused silica using C4F8/Ar inductively coupled plasmas, J Mater Sci: Mater Electron, 7, 2016

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09-27

2019

Investigation of fused silica glass etching using C4F8/Ar inductively coupled plasmas for through glass via (TGV) applications, Microsystem Technologies,22(1), 119–127, 2016

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09-27

2019

Diagnosis and optimization of a power distribution network by extracting its parasitic inductances and building a lumped circuit model, Microsystem Technologies, 1-8, 2015

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09-27

2019

Tunable photonic microwave generation by directly modulating a dual-wavelength amplified feedback laser, Optics Communications, 345(15 ), 57-61, 2015

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09-27

2019

Complementary metal–oxide–semiconductor compatible 1060 nm photodetector with ultrahigh gain under low bias, Optics letter, 40(19), 4440-4443, 2015

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09-27

2019

TSV Backside Reveal by a Wet Etching Process. ECS Transactions, 60(1):401-406. 2014

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09-27

2019

The effect of temporary bonding on post processing in TSV interposer manufacturing, Microsystem Technologies, 1-7, 2014

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09-27

2019

A Surface Mounting Embedded Optical Transceiver with Bi-directional Data Rate of 8 Channels × 10Gbps, Fiber and Integrated Optics,33, 1-2,2014

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09-27

2019

Properties and electric characterizations of tetraethyl orthosilicate-based plasma enhanced chemical vapor deposition oxide film deposited at 400 °C for through silicon via application, Thin Solid Films,550, 259-263, 2014

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